6 Layer OSP Green Solder Mask Circuit Board 1 OZ CU
Main Features:
Part NO: OSPPCB0001
Layer Count: 6 Layer PCB
Finished Board Thickness: 1.6MM
Copper Thickness: 1/H/H/H/H/1
Min Lind Space&Width: 4/4mil
Application Area: Invertor
Solder Mask: Green Solder Mask
Acceptance Standards: IPC 6012 CLASS2
Copper wall thickness for plated through holes: 25um
Our production applications:
1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.
2 Industrial control:main boards in machines, industrial robots, servo motors etc.
3 Automotive: BMS main boards, automotive radar etc.
4 Power supplies: UPS, industrial power supply, frequency power supply.
5 Medical: medical equipment, medical equipment power supply.
6 Communication products: 5G base station, routers, satellites, antennas.
7 Photovoltaic inverter
| Delivery Acceptance Requirements: | |
| Test | All boards are tested in accordance with IPC-9252A |
| Working Gerber | Paste layers must be provided on working gerbers. |
| | If Paste layer is missing, alert us in EQ. |
| Fab File | Check original customer Fab file if provided. |
| | If there is a conflict between customer FAB and this |
| | document, please ask in your EQ questions. |
| Approvals | Send working gerber and EQ together. |
| RoHS & REACH | All materials must be RoHS & REACH compliant. |
| | All processes must be RoHS & REACH compliant. |
| Documents | Send PDF copy of all test, measurement, conformance |
| | and certificates. No paper or core sample needed. |
Product Tags:
|
|
6 Layer OSP Green Solder Mask Multilayer Circuit Board 1OZ CU Images
|
